NSC35/Ti-Pt

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Probe
SEM image of uncoated silicon SPM probe tip
Silicon etched probe tip of the NSC series has a conical shape.

Typical probe tip radius of uncoated tip
10 nm

Full tip cone angle*
40°

Tip aspect ratio
more than 3:1 (4:1 typical)

Total tip height
20..25 µm

Probe material
n-type silicon (phosphorus doped)

Probe bulk resistivity
0.01..0.05 Ohm*cm

*The full cone angle may be less than 40° at the last 200 nm of the tip end.
Cantilevers
SEM image of 3 cantilevers (A, B, C) on chip of the 35th series. Schematic drawing of the probe chip.
35 Series,
Cantilevers
 Resonant Frequency, kHz Spring Constant, N/m Length
l ± 5,
µm		 Width
w ± 3,
µm		 Thickness
t ± 0.3,
µm
min typ max min typ max
A 165 210 240 3.5 7.5 12.5 110 35 2.0
B 240 315 405 6.5 14.0 27.5 90
C 120 150 190 3.5 4.5 8.5 130

Coating

The Ti-Pt coating consists of a 10-nm Pt layer on a 20-nm Ti sublayer, which increases adhesion and electromigration firmness of Pt. The Ti-Pt coating is formed on both tip and reflective side of the cantilever.

Resulting tip radius with the coating
40.0 nm.

 
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